Sophon PFG-1 AI ASIC packs 330 GB on-die DRAM in monolithic 3D design
Sophon has released the PFG-1, a monolithic‑3D AI ASIC. The chip incorporates 330 GB of DRAM directly on the die.
Sophon has released the PFG-1, a monolithic‑3D AI ASIC. The
chip incorporates 330 GB of DRAM directly on the die.
Integrating memory on‑die removes the requirement for
external HBM. The design aims to improve bandwidth and
reduce latency. A single‑chip solution simplifies system
architecture. The whitepaper details the ASIC's technical
specifications. The approach targets high‑performance AI
workloads. Further evaluation will assess real‑world
efficiency gains.