Oxford Instruments Powers ROHM’s In‑House GaN Production with New 200 mm Etch Tool

Oxford Instruments announced a partnership with ROHM. The collaboration introduces advanced etch technology for gallium nitride wafers. The equipment supports 200 mm wafer production. ROHM will conduct GaN manufacturing internally using the new tool. The technology aims to improve yield and reduce reliance on external suppliers. Oxford Instruments’ solution targets semiconductor fabs seeking tighter process control. The move reflects growing demand for GaN in power and RF applications. Industry observers will watch ROHM’s first runs for performance data.